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Structured Review

West Bond Inc westbond wire bondeir
Westbond Wire Bondeir, supplied by West Bond Inc, used in various techniques. Bioz Stars score: 86/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/wire/pm42284299-232-29-29
Average 86 stars, based on 1 article reviews
westbond wire bondeir - by Bioz Stars, 2026-10
86/100 stars

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Related Articles

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Article Title: Toward quantum sensing of electron beams using solid-state spins.
Article Snippet: The sample is then mounted onto a printed circuit board (PCB) using vacuum-compatible silver paste and the chip contacts are connected to the PCB using several wirebonds with the Westbond wire bondEIR.

Article Title: Coordinated behavior of autonomous microscopic machines through local electronic pulse coupling.
Article Snippet: The paddles were then packaged into a chip carrier with DIP (CSB06428D) from Spectrum using aluminum wires via wire bonding (Westbond 7400A Ultrasonic Wire Bounder).

Article Title: Polarimeter and method of determining a state of polarization of an incoming light beam
Article Snippet: The electrical connections were realized using Westbond's 7400A Wire Bonder.

Article Title: Nanopore sensor calibration and operation with a fluidic passage
Article Snippet: The source and drain electrical contacts of the device were wired to copper fingers on the chip carrier by wire bonding (West-Bond Inc., Anaheim, CA).

Article Title: Design, Fabrication, and Dynamic Analysis of a MEMS Ring Resonator Supported by Twin Circular Curve Beams
Article Snippet: The final device was packaged by wire bonding (West-Bond Inc., model 4546E). depicts the SEM of the fabricated ring resonator.

Article Title: Synthesis and structure of a non-van-der-Waals two-dimensional coordination polymer with superconductivity
Article Snippet: Single crystal devices were bonded to chips of attoDRY 2100 with aluminum wire using WestBond 7476D wire bonder.

Adhesive:

Article Title: Permanent Dipole Moment in a Quantum-Confined Two-Dimensional Metal Revealed by Electric Double Layer Gating
Article Snippet: .. Sample chips were adhered to a chip carrier (Evergreen semiconductor) using Norland 68 ultraviolet-curable adhesive (cured with UV light λ = 365 for 10 min.) Wire bonds were made with a WestBond wire bonder with an ultrasonic time of 30 ms at a power of 400 W used for both bonds. ..



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